Extruder temperature: 230-300ºC (240-260ºC recommended)
Build plate temperature: 60-180ºC
Chamber temperature: Up to 180ºC
Bed Adhesive: Nano Polymer Adhesive
AquaSys® 180 is engineered for enhanced adhesion and high thermal stability. Together, these properties allow it to bond effectively to a wide range of hydrophobic and hydrophilic materials. And while it does adhere to most commonly used 3D printing materials, it’s recommended primarily for use with PEEK, PEKK, PEI, and PPSU.
Working with lower temperature materials like ABS or PP? Try AquaSys ®120.
AquaSys® 180 filament is designed for use in fused filament fabrication (FFF) printers.
Pathway temperature: Keep the filament below 80°C prior to extrusion. Material that sits idle at temperatures of 80°C or above for extended periods of time prior to extrusion will not extrude properly.
Nozzle temperature: 230 - 300°C
Build plate requirements: AquaSys filaments will adhere to a wide range of build plate materials. If poor adhesion is persistent, increase the temperature of the build plate, but not past the maximum build plate temperature of 180°C.
Adhesives: Nano Polymer Adhesive
Pair AquaSys 180 with any of the following: PEEK, PEKK, PEI, PPSU, CFPEEK, and more.